The Breakout Board transfers the SMD footprint to 2.54 mm headers and can be ordered as single component (without IR emitter) or assembled with an IR emitter of the HISsmd series.
We offer an extensive range of Breakout Boards (BOB) and Driver Circuit Boards (DCB) to support your evaluation and implementation of our thermal infrared emitters in your applications. If you need other technical specifications and you are interested in an individual driver electronics, feel free to contact us. We kindly support your evaluation and product development!
Are you looking for other technical specifications or would you like a customized solution? Feel free to contact us!